mi!Pico™

Product Description

miPicocell

Complete LTE Physical & Protocol Layers for Picocells on SDR, DSP & ASIC Platforms

  • mi!PicoPHYTM 3GPP Fully Compliant LTE PHY
  • mi!PicoSTACKTM 3GPP Fully Compliant LTE MAC, RLC, PDCP, RRC, S1AP, X2AP, GTP-U, SCTP, RRM, SON & ANR
  • Entirely software defined delivering and enabling flexibility and scalability
  • Optimized for low memory, processing power, and power consumption
  • Advanced SON algorithms
  • Comprehensive & configurable debug infrastructure
  • Femto Forum API (FFAPI) compliant 

mi!Pico™ is based on a modular architecture and flexible interfaces to enable fast porting and easy adaptation to specific system modules. Since the LTE standard is defined for a large range of system capabilities, the software has been made highly configurable. This enables tailoring of the required features and efficient utilization of the available hardware resources; reduction of the required resources will minimize the bill of materials for the end device. The software is fully compliant with 3GPP Release 8. The design benefits from the strong experience of mimoOn in high performance algorithms for multi-antenna systems. This is a crucial feature for efficient spectrum usage and maximal data throughput within the system. This means among other features, 64QAM modulation at highest data rates, and all MIMO modes such as SISO, SM, and SFBC. 

Key Features

  • 3GPP Fully Compliant LTE PHY, MAC, RLC, PDCP, RRC, S1AP, X2AP, GTP-U, SCTP, RRM, SON & ANR
  • Implemented on Low Cost, High Performance Industry leading Baseband Chipset
  • Entirely Software Defined, Easy to Customize and Upgrade
  • Designed in ANSI C which Allows Flexibility and Scalability
  • Innovative Algorithms such as Advanced Schedulers for Enhanced Spectrum Efficiency
  • Advanced Femtocell Innovations such as Performance-Optimized MIMO and Self-Organizing Networks
  • Comprehensive and Configurable Debug Infrastructure
  • Pre-certified through Test Partners
  • Quick Time-to-Market and Low Risk

Key Specifications

  • 3GPP Release 8 with a roadmap to Release 9 & 10
  • FDD/TDD
  • All DL channels implemented (PBCH, PCFICH, PDCCH, PDSCH, PHICH, PSS/SSS)
  • SISO and all MIMO modes (transmit diversity, large delay CDD, closed loop spatial multiplexing)
  • DL power control
  • All resource allocation types (including virtual resource blocks)
  • All UL channels implemented (SRS, PRACH, PUCCH, PUSCH)
  • All hopping modes included
  • Channel estimation and timing measurement
  • Interference estimation
  • HARQ control
  • SON
  • mi!Spectrum Scheduler

Platforms

Texas Instruments are the world leading supplier of high performance DSPs for wireless Infrastructure. mimoOn’s mi!PicoPHY™ software has been integrated on TI’s TMS320TC66xx highly flexible, scaleable processors targeting small cell basestations.

TI’s C66xx KeyStone series processors allow equipment manufacturers the advantages of design and code reuse, since the processors can be scaled to meet both the intensive processing demands of macro basestations, as well as the new generation of LTE Base Stations.

In addition, mimoOn offers the 3GPP LTE Stack software package mi!PicoSTACK™  for many types of stack processors. The implementation is in ANSI C/C++ and is suitable to be ported to a wide variety of embedded processors including ARM, MIPS and Intel.

For more information on TI's small cell solutions, click here

 

CEVA Logo

CEVA Inc. are a leading licensor of DSP IP cores. CEVA-XC™ is a high-performance, low-power DSP processor designed and optimized for advanced wireless communications processing in mobile handsets as well as wireless Infrastructure applications. A single CEVA-XC core is capable of handling complete 3.5G and 4G transceiver paths of in software. As a fully programmable architecture CEVA-XC supports multiple air interfaces including LTE, WiMAX, HSPA, alongside 3G and 2G in software. mi!PicoPHY™, mimoOn’s advanced software for UEs, is implemented on CEVA’s XC323 processor and can handle real-time use cases for LTE such as streaming HD video using 64QAM and 5MHz channels.

For more information on CEVA's XC platform, please click here

 

 

 

Tensilica® Inc., are a leader in efficient dataplane processor (DPU) IP cores for advanced mobile wireless & Infrastructure SOCs (system-on-chips). Tensilica’s ConnX Baseband Engine (BBE) and Atlas LTE Reference designs will be available with mimoOn’s mi!PicoPHY™ software.

Tensilica’s ConnX BBE based wireless radio platform enables efficient baseband processing for 3G, LTE and 4G wireless equipment. The combination of Tensilica’s optimized high-performance DSPs (digital signal processors) and controllers integrated in a single DPU platform provides designers with the ability to make the right tradeoffs between size, power and programmability to meet the challenging needs of the next generation radios.

Tensilica's Xtensions Partner Program brings its LTE (Long Term Evolution) baseband handset and base station design customers a robust Infrastructure of top-tier  partners in SOC (system-on-chip) design-critical areas such as LTE physical layer software solutions, system level modeling, real time operating systems emulation, and design services.

For more information on Tensilica's ConnX solutions, please click here