mi!MobilePHY™

Product Description

miMOBILE Devices

LTE Physical Layer for UE (User Equipment) on SDR, DSP & ASIC Platforms

  • mi!MobilePHY™ 3GPP Releases 8 and 9 FDD & TDD Fully Compliant LTE PHY
  • Entirely Software Defined delivering complete flexibility and scalability
  • Optimized for low memory, processing power, and power consumption
  • Innovative algorithms such as advanced MIMO detectors
  • Comprehensive and configurable debug infrastructure
  • Pre-certified with leading test partners

mi!MobilePHY™ is based on a modular architecture and flexible interfaces to enable fast porting and easy adaptation to specific system modules. Since the LTE standard is defined for a large range of system capabilities, the software has been made highly configurable.

This enables

  • tailoring of the required features and efficient utilization of the available hardware resources
  • reduction of the required resources will minimize the bill of materials for the end device.
  • The software is fully compliant with 3GPP Release 8 and supports all mandatory and optional features.
  • The design benefits from the strong experience of mimoOn in high performance algorithms for multi-antenna systems. This is a crucial feature for efficient spectrum usage and maximal data throughput within the system.
  • All user equipment categories are supported. This means among other features, 64QAM modulation at highest data rates, and all MIMO modes such as SISO, SM, and SFBC. 

Key Features

  • 3GPP Fully Compliant LTE PHY
  • FDD & TDD supported
  • Full Featured and Compliant to Release 8 Standard
  • Implemented on Next Generation Processor Platforms
  • Entirely Software Defined, Easy to Customize and Upgrade
  • Designed in ANSI C which Allows Flexibility and Scalability
  • Innovative Algorithms such as Advanced MIMO Detectors
  • Comprehensive and Configurable Debug Infrastructure
  • Pre-certified through Leading Test Partners
  • Quick Time-to-Market and Low Risk Turnkey Solution

Key Specifications

  • 3GPP release 8 with a roadmap to Release 9 & 10
  • FDD & TDD 
  • 150 Mbit/s DL data rate, 75 Mbit/s UL data rate
  • All bandwidths available (1.4 – 20 MHz)
  • All DL channels implemented (PBCH, PCFICH, PDCCH, PDSCH, PHICH, PSS/SSS)
  • Time domain synchronization and RF compensation
  • Advanced channel estimation
  • Advanced equalization (MRC, MMSE, near ML)
  • SISO and all MIMO modes (transmit diversity, large delay CDD, closed loop spatial multiplexing)
  • HARQ control
  • DL Measurement (RSRP/RSRQ + CQI/PMI/RI)
  • All UL channels implemented (SRS, PRACH, PUCCH, PUSCH)
  • UL Power control
  • Timing advance
  • PRACH contention resolution
  • PHY control
  • Interface to MAC via PAL (Physical Abstraction Layer)

Applications

For SoC vendors who develop products for the following markets:

  • Datacards
  • USB Dongles
  • Netbooks
  • Tablet PCs
  • e-Book readers
  • Mobile multimedia devices
  • Smartphones

Platforms

Tensilica

Tensilica® Inc., are a leader in efficient dataplane processor (DPU) IP cores for advanced mobile wireless SOCs (system-on-chips). Tensilica’s ConnX Baseband Engine (BBE) and Atlas LTE Reference designs will be available with mimoOn’s mi!MobilePHY™ software.

Tensilica’s ConnX BBE based wireless radio platform enables efficient baseband processing for 3G, LTE and 4G wireless equipment. The combination of Tensilica’s optimized high-performance DSPs (digital signal processors) and controllers integrated in a single DPU platform provides designers with the ability to make the right tradeoffs between size, power and programmability to meet the challenging needs of the next generation radios.

 

Tensilica's Xtensions Partner Program brings its LTE (Long Term Evolution) baseband handset and base station design customers a robust infrastructure of top-tier  partners in SOC (system-on-chip) design-critical areas such as LTE physical layer software solutions, system level modeling, real time operating systems emulation, and design services.

For more details on Tensilica’s ConnX BBE, please click here.