mi!™ Technology Platform
Our mi!™ solutions are designed with the future in mind.
We understand our customers need to differentiate their products in a competitive market. Coupled with the ongoing requirements to reduce risk & costs and the need to increase re-use, mimoOn provide solutions for the following markets:-
- Wireless mobile products for smartphones, USB dongles, modules, datacards
- Wireless Infrastructure products for Macrocell, Microcells, Picocells, Femotcells & Relays
Features and benefits of the mi!TM Technology Platform
- 3GPP standards compliant ensuring 100% alignment with the standards & future proofing your investment
- C based software platform delivering complete flexibility in choice of HW platform for your specific needs
- Pre-integrated onto leading chipset & DSP IP core solutions providing fast time to market & lower development costs
- Leading chipset and IP core partner ecosystem enabling turnkey platforms
- Flexible & competitive licensing terms providing efficiencies & control of development budgets
Our product deliverables include
- Availability as a reference chain, providing ultimate flexibility to OEM's building their silicon IP from scratch
- Pre-ported & validated PHY & Stack delivering an IP HW & SW block for integration into your silicon design
- Pre-integrated PHY & Stack on silicon devices, for immediate use in your wireless product development
Platforms
CEVA-XC
CEVA Inc are a leading licensor of DSP IP cores. CEVA-XC™ is a high-performance, low-power DSP processor designed and optimized for advanced wireless communications processing in mobile handsets as well as wireless infrastructure applications. A single CEVA-XC core is capable of handling complete 3.5G and 4G transceiver paths of in software. As a fully programmable architecture CEVA-XC supports multiple air interfaces including LTE, WiMAX, HSPA, alongside 3G and 2G in software. mi!MobilePHY™ & mi!FemtoPHY™, mimoOn’s advanced software for UEs and Femtocell, is implemented on CEVA’s XC323 processor and can handle real-time use cases for LTE such as streaming HD video using 64QAM and 5MHz channels.
www.ceva-dsp.com/products/cores/ceva-xc323.php
CEVA-XCnet Partner Program
The CEVA-XCnet Partnership Program is a comprehensive network of strategic third-party technology suppliers that together form a robust infrastructure around the CEVA-XC communications processor for LTE.
MimoOn have partnered with CEVA to offer mimoOn’s mi!MobilePHY advanced Long-Term Evolution (LTE) software on the CEVA-XC DSP Core. The full-featured and certified mi!MobilePHY LTE software solution targets user equipment based on the 3GPP Standards Release 8.
TEXAS INSTRUMENTS
Texas Instruments are the world leading supplier of high performance DSPs for wireless infrastructure. mimoOn’s mi!FemtoPHY™& mi!PicoPHY™ software has been integrated on TI’s TCS66xx highly flexible, scaleable processors targeting LTE products. In addition, mimoOn's mi!FemtoSTACK™& mi!PicoSTACK™ software is capable of running on ARM, MIPS and Intel based CPU's. Other stack processors can also be supported.
TI’s 66xx series processors allow equipment manufacturers the advantages of design and code reuse, since the processors can be scaled to meet both the intensive processing demands of macro basestations, as well as the cost constraints of the residential femtocell.
Tensilica
Tensilica® Inc., are a leader in efficient dataplane processor (DPU) IP cores for advanced mobile wireless SOCs (system-on-chips). Tensilica’s ConnX Baseband Engine (BBE) and Atlas LTE Reference designs will be available with mimoOn’s mi!MobilePHY™ software.
Tensilica’s ConnX BBE based wireless radio platform enables efficient baseband processing for 3G, LTE and 4G wireless equipment. The combination of Tensilica’s optimized high-performance DSPs (digital signal processors) and controllers integrated in a single DPU platform provides designers with the ability to make the right tradeoffs between size, power and programmability to meet the challenging needs of the next generation radios.
Tensilica's Xtensions Partner Program brings its LTE (Long Term Evolution) baseband handset and base station design customers a robust infrastructure of top-tier partners in SOC (system-on-chip) design-critical areas such as LTE physical layer software solutions, system level modeling, real time operating systems emulation, and design services.
For more details on Tensilica’s ConnX BBE, please click here.